Product Description

Model: XG-50

Place of Origin: Hong Kong

Scope of application: mobile phone chip repair computer or home appliance chip patch repair BGA special products chip level repair tools
 
Applicable models: planting tin for mobile phone repair, BGA planting for electronic industry computers, etc.
 
Features: The solder joint is white and full, there is no such phenomenon as virtual soldering, false soldering, etc., and it has a strong resilience with the soldering iron tip.
 
Maintenance of mobile phones, precision equipment must not be small products. It is also an ideal product for welding on electronic production lines.

Packaging Details

·         Unit Type:piece

·         Package Weight:0.045kg (0.099lb)

·         Package Size:4cm x 3cm x 3cm (1.57in x 1.18in x 1.18in)